Prototipadora de Circuito Impresso BotFactory Série SV2

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BotFactory SV2 PCB Printer - Print and assemble large, high-density Printed Circuit Boards faster than any third-party vendor and for less


The SV2 is our second-generation Desktop PCB Printer, capable of printing multilayer circuits, dispensing paste onto pads, and pick-and-placing components onto the board.

We have taken all of the processes found in any PCB Factory and miniaturized them to fit within a package so small that it can fit between your computer and your oscilloscope. Simply export your Gerber files from any PCB Design tool and import them in SV2 - print circuit boards in minutes!


Printing - Inkjet Conductive & Insulating Inks

SV2 can inkjet print low-resistivity conductive inks and dielectric insulating inks to make Printed Circuit Boards (PCBs) in minutes on a variety of stiff and flexible substrates.

SV2 sequentially prints conductive traces and insulating layers, building vias in the dielectric layer to interconnect layers.


Dispensing - Extrude conductive glues or solder pastes

Lay down conductive glue or solder paste on printed or pre-fab boards in minutes using the Paste head.

SV2 takes eyesight and shaky hands out of the equation by precisely depositing on every pad.


Assembly - Pick and Place, efficiently and accurately

Printed Circuit Board Assembly (PCBA) can consume up to 80% of the entire cost of manufacturing an assembled PCB. In addition, a long back-and-forth can be required with the fab house to make sure they can source and place the parts.

SV2 can pick-and-place components to rapidly assemble your board, using multiple vacuum tips that are automatically interchanged. SV2 also uses a camera and computer vision to make adjustments and place the parts precisely.


Pick your model:

ModelSV2 Starter - Starter packageSV2 Enhanced - Build more complex boardsSV2 Professional - Full capabilities
Print CapabilityTrace Width: 8 mil [200 microns]
Pin Pitch: 24 mil [0.6 mm]
Layers: 2
Trace Width: 8 mil [200 microns]
Pin Pitch: 20 mil [0.5 mm]
Layers: 2
Trace Width: 8 mil [200 microns]
Pin Pitch: 16 mil [0.4 mm]
Layers: 4
Package sizesSOIC, SSOP, TSOP Type II, TSSOP, QFP.
*minimum pitch size = 0.6mm
SOIC, SSOP, TSOP Type I and Type II,
TSSOP, QFP.
*minimum pitch size = 0.5mm
SOIC, SSOP, TSOP Type I and Type II,
TSSOP, QFP.
*minimum pitch size = 0.4mm
Enclosure(Optional)(Optional)Included




Specifications

Printing

​Print Technology: ​Thermal Inkjet Printing

​Number of Inkjet Nozzles: ​300

​Ink Types (curing method): ​Conductive (heat), Insulating (UV)

​Min. Trace Width: 8 mils [200 microns]

​Min. Pin Pitch: ​SV2 – Starter: 24 mil [600 microns]; SV2 – Enhanced: 20 mil [500 microns]; SV2 – Professional: 16 mil [400 microns]

​Min. Via Dimension: ​Diameter: 25 mil [600 microns]

Drill Size: 15 mil [400 microns]

​Max. Printable Area: 4.6" x 6" [117 x 152 mm] [X/Y]

​Conductive Ink Sheet Resistance: ​40 mOhms/square

​Number of Layers: 1-2 (Starter & Enhanced) or 1-4 (Professional)

​Part attachment: We recommend using our strong conductive epoxy. Soldering using the copper PCB rivet tool (sold seperately)

​Supported Formats: GERBER RS-274X, . jpg, .png, .tiff, .bmp


Dispensing

Paste Technology: Syringe Extrusion

Paste Types: Conductive Epoxy and Solder Paste

Extruded Dot Size: 8 mils [200 microns]

​Curing Method: Heat

Supported Formats: GERBER RS-274X, . jpg, .png, .tiff, .bmp


Assembling

Camera: 5 MP, Upward Facing

Tray: Types Tape, Individual components

Tape Tray: Number of Slots x Tape Width 6 x 8mm tapes, 2 x 12mm, 1 x 16mm Cut Tapes

Tray: Parts loaded: Max. 42 per batch

Min. Part Size: 0603 [1608 Metric]

Max. Part Size: 0.78” x 0.78” [20 x 20 mm]

Supported Formats: Centroid file (text file describing Reference Designator, Footprint, X/Y location, and Rotation). The file can be generated by your CAD tool


Mechanical

- General

Max. Substrate Size: 6" x 6" [152 x 152 mm] [X/Y]

Max. Circuit Size: 4.6" x 6" [117 x 152 mm] [X/Y]

Heads: Weight: Less than 1.1 lbs [500g] per head

XYZ Positioning Repeatability: ± 2.76 mil [70 microns]

XYZ Positioning Resolution: 0.39 mil [10 microns]


- Without the Enclosure

​Frame: Size: 16.5" L x 14" W x 17.5" H [42 x 35.5 x 44.5 cm]

Additional Clearance Req.: 3" [7.5 cm] in front, 4" [10 cm] in the back

Frame: Weight: 30 lbs. [13.5 kg]

Shipping Box: Size: 21.5" L x 17" W x 27" H [55 x 43.2 x 68.6 cm]

Shipping Box: Total Weight: 50 lbs. [22.5 kg]


- With the Enclosure

​Enclosure: Size: 24.8” L x 17” W x 18” H [63 x 43 x 46 cm]

Additional Clearance Req.: 6” [15 cm] on the right

Enclosure: Weight: 46 lbs. [21 kg]

Unit: Total Weight: 81.5 lbs. [37 kg]

Shipping Box: Size: 30” L x 28” W x 22” H [76 x 71 x 56 cm]

Shipping Box: Total Weight: 106 lbs. [48 kg]


Electrical

Power: DC 24V 22A

Connection: Ethernet, Wi-Fi


Software

​Installation: None (Software runs on-board)

System Requirements: Web browser (Platform-independent)

Recommended Browser: Firefox, Chrome

Offline Updates: Available on demand (USB3.0)


Temperature

Ambient: Operating: 50-100F [10-40℃]            

Heat Bed: Operating: 75-300F [25-150℃]

Heat Bed: Max: 340F [170℃]


Ambient Operating Requirements

Ambient Temperature: 50-100F [10-40℃]            

While operating without the enclosure: Protect the work area from air flows; Avoid camera exposure to direct sunlight to improve the reliability of the Computer vision

Other: Operation in a ventilated area recommended 



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