Prototipadora de Circuito Impresso BotFactory Série SV2
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BotFactory SV2 PCB Printer - Print and assemble large, high-density Printed Circuit Boards faster than any third-party vendor and for less
The SV2 is our second-generation Desktop PCB Printer, capable of printing multilayer circuits, dispensing paste onto pads, and pick-and-placing components onto the board.
We have taken all of the processes found in any PCB Factory and miniaturized them to fit within a package so small that it can fit between your computer and your oscilloscope. Simply export your Gerber files from any PCB Design tool and import them in SV2 - print circuit boards in minutes!
Printing - Inkjet Conductive & Insulating Inks
SV2 can inkjet print low-resistivity conductive inks and dielectric insulating inks to make Printed Circuit Boards (PCBs) in minutes on a variety of stiff and flexible substrates.
SV2 sequentially prints conductive traces and insulating layers, building vias in the dielectric layer to interconnect layers.
Dispensing - Extrude conductive glues or solder pastes
Lay down conductive glue or solder paste on printed or pre-fab boards in minutes using the Paste head.
SV2 takes eyesight and shaky hands out of the equation by precisely depositing on every pad.
Assembly - Pick and Place, efficiently and accurately
Printed Circuit Board Assembly (PCBA) can consume up to 80% of the entire cost of manufacturing an assembled PCB. In addition, a long back-and-forth can be required with the fab house to make sure they can source and place the parts.
SV2 can pick-and-place components to rapidly assemble your board, using multiple vacuum tips that are automatically interchanged. SV2 also uses a camera and computer vision to make adjustments and place the parts precisely.
Pick your model:
| Model | SV2 Starter - Starter package | SV2 Enhanced - Build more complex boards | SV2 Professional - Full capabilities |
| Print Capability | Trace Width: 8 mil [200 microns] Pin Pitch: 24 mil [0.6 mm] Layers: 2 | Trace Width: 8 mil [200 microns] Pin Pitch: 20 mil [0.5 mm] Layers: 2 | Trace Width: 8 mil [200 microns] Pin Pitch: 16 mil [0.4 mm] Layers: 4 |
| Package sizes | SOIC, SSOP, TSOP Type II, TSSOP, QFP. *minimum pitch size = 0.6mm | SOIC, SSOP, TSOP Type I and Type II, TSSOP, QFP. *minimum pitch size = 0.5mm | SOIC, SSOP, TSOP Type I and Type II, TSSOP, QFP. *minimum pitch size = 0.4mm |
| Enclosure | (Optional) | (Optional) | Included |
Specifications
Printing
Print Technology: Thermal Inkjet Printing
Number of Inkjet Nozzles: 300
Ink Types (curing method): Conductive (heat), Insulating (UV)
Min. Trace Width: 8 mils [200 microns]
Min. Pin Pitch: SV2 – Starter: 24 mil [600 microns]; SV2 – Enhanced: 20 mil [500 microns]; SV2 – Professional: 16 mil [400 microns]
Min. Via Dimension: Diameter: 25 mil [600 microns]
Drill Size: 15 mil [400 microns]
Max. Printable Area: 4.6" x 6" [117 x 152 mm] [X/Y]
Conductive Ink Sheet Resistance: 40 mOhms/square
Number of Layers: 1-2 (Starter & Enhanced) or 1-4 (Professional)
Part attachment: We recommend using our strong conductive epoxy. Soldering using the copper PCB rivet tool (sold seperately)
Supported Formats: GERBER RS-274X, . jpg, .png, .tiff, .bmp
Dispensing
Paste Technology: Syringe Extrusion
Paste Types: Conductive Epoxy and Solder Paste
Extruded Dot Size: 8 mils [200 microns]
Curing Method: Heat
Supported Formats: GERBER RS-274X, . jpg, .png, .tiff, .bmp
Assembling
Camera: 5 MP, Upward Facing
Tray: Types Tape, Individual components
Tape Tray: Number of Slots x Tape Width 6 x 8mm tapes, 2 x 12mm, 1 x 16mm Cut Tapes
Tray: Parts loaded: Max. 42 per batch
Min. Part Size: 0603 [1608 Metric]
Max. Part Size: 0.78” x 0.78” [20 x 20 mm]
Supported Formats: Centroid file (text file describing Reference Designator, Footprint, X/Y location, and Rotation). The file can be generated by your CAD tool
Mechanical
- General
Max. Substrate Size: 6" x 6" [152 x 152 mm] [X/Y]
Max. Circuit Size: 4.6" x 6" [117 x 152 mm] [X/Y]
Heads: Weight: Less than 1.1 lbs [500g] per head
XYZ Positioning Repeatability: ± 2.76 mil [70 microns]
XYZ Positioning Resolution: 0.39 mil [10 microns]
- Without the Enclosure
Frame: Size: 16.5" L x 14" W x 17.5" H [42 x 35.5 x 44.5 cm]
Additional Clearance Req.: 3" [7.5 cm] in front, 4" [10 cm] in the back
Frame: Weight: 30 lbs. [13.5 kg]
Shipping Box: Size: 21.5" L x 17" W x 27" H [55 x 43.2 x 68.6 cm]
Shipping Box: Total Weight: 50 lbs. [22.5 kg]
- With the Enclosure
Enclosure: Size: 24.8” L x 17” W x 18” H [63 x 43 x 46 cm]
Additional Clearance Req.: 6” [15 cm] on the right
Enclosure: Weight: 46 lbs. [21 kg]
Unit: Total Weight: 81.5 lbs. [37 kg]
Shipping Box: Size: 30” L x 28” W x 22” H [76 x 71 x 56 cm]
Shipping Box: Total Weight: 106 lbs. [48 kg]
Electrical
Power: DC 24V 22A
Connection: Ethernet, Wi-Fi
Software
Installation: None (Software runs on-board)
System Requirements: Web browser (Platform-independent)
Recommended Browser: Firefox, Chrome
Offline Updates: Available on demand (USB3.0)
Temperature
Ambient: Operating: 50-100F [10-40℃]
Heat Bed: Operating: 75-300F [25-150℃]
Heat Bed: Max: 340F [170℃]
Ambient Operating Requirements
Ambient Temperature: 50-100F [10-40℃]
While operating without the enclosure: Protect the work area from air flows; Avoid camera exposure to direct sunlight to improve the reliability of the Computer vision
Other: Operation in a ventilated area recommended
